2026 International Conference on Integrated Circuits, Signal Processing, and Electronic Information

About to ICSPEI 2026

The International Conference on Integrated Circuits, Signal Processing and Electronic Information (ICSPEI 2026) will be held grandly in Harbin, a science and technology hub in northern China. This conference focuses on the collaborative development of integrated circuit design, advanced signal processing technology, and electronic information systems, aiming to build a high-level and specialized international academic exchange platform, gathering experts, scholars, researchers, chip design engineers, and industry technology representatives in the fields of microelectronics, integrated circuit engineering, signal and information processing, communication systems, embedded technology, semiconductor devices, and intelligent electronics. The conference will conduct in-depth discussions on cutting-edge topics such as high-performance analog/digital integrated circuit and mixed signal chip design, RF and millimeter wave integrated circuit applications in 5G/6G communication, low-power and high reliability integrated circuit architecture, artificial intelligence accelerator chip and storage computing integrated technology, progress of new semiconductor materials (such as SiC, GaN) in power devices, real-time signal processing algorithms and DSP implementation, deep learning processing of image and speech signals, multi-sensor fusion and radar signal processing, high-speed data acquisition and transmission systems, integrated circuit packaging and testing technology, and domestic EDA tool ecosystem construction. Through various forms such as keynote speeches, thematic forums, paper presentations, design case sharing, and technology demonstrations, we aim to promote collaborative innovation across the entire "chip road computing" chain and help break through key core technology bottlenecks. ICSPEI 2026 emphasizes the core concept of "chip oriented, trust oriented", committed to enhancing China's independent innovation capabilities in the high-end chip and electronic information fields, serving the national integrated circuit development strategy and cultivating new quality productivity. The high-quality papers accepted by the conference will be recommended for publication in relevant international journals indexed by EI, Scopus, or IEEE, expanding the academic influence of the research findings.